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ATCR1R5 1.5W/mK Silicone Thermal Pad (200×200mm)

Price range: $10.00 through $32.00

Silicone Thermal Conductive Pad
Thermal Conductivity: 1.5 W/m·K
Thickness: 0.5–8.0 mm (11 options)
Dimensions: 200 × 200 mm
Material: Silicone Elastomer
Application: TEC modules, electronic component thermal interface

Discount per Quantity

QuantityPrice
1 - 9$10.00
10 - 49 Price range: $9.50 through $30.40
50 - 99 Price range: $9.00 through $28.80
100 + Price range: $8.50 through $27.20

Product Overview

ATCR1R5 series is a silicone-based soft thermal conductive pad rated 1.5 W/m·K, supplied as a 200 × 200 mm sheet in 11 thickness options from 0.5 mm to 8.0 mm. The pad fills micro-gaps between heat sources and heat sinks, eliminating air pockets and delivering efficient heat transfer in low-pressure applications.
Naturally tacky on both faces with electrical insulation, shock absorption, and UL 94 V0 flame rating. Operates stably from −40°C to +150°C. Widely used in CPU/GPU cooling modules, LED lighting, automotive ECUs, LCD backlights, and power conversion devices; pairs well with ATI heat sinks and TEC modules.

Specifications

Thermal Conductivity 1.5 W/m·K
Thickness Range 0.5–8.0 mm
Dimensions 200 × 200 mm
Material Silicone Elastomer with Ceramic Filler
Operating Temperature −40°C to +150°C
Flame Rating UL 94 V0
Electrical Insulating
Lead-Free / RoHS Yes

Applications

As technology and manufacturing have advanced, thermal silicone pads have become widely used in electronic products, automotive systems, computers, DVD and VCD players, and other equipment that requires gap filling and heat dissipation. A thermal silicone pad is a thermal interface material made from silicone gel, metal oxides, and other auxiliary fillers. Its main function is to conduct heat across the gap between a heat source and a heat sink, while also providing electrical insulation, shock absorption, and sealing.

Handling and Installation

  1. Keep both contact surfaces clean. Dust, oil, or other contamination degrades the self-adhesive tack and reduces thermal conductivity.
  2. Support a large pad at its center when handling it; small pads require no special handling. Uneven force on a large pad can deform it and complicate the steps that follow.
  3. Do not remove both protective films at the same time. Keeping one film in place limits handling and reduces direct contact with the exposed pad surface.
  4. Peel off one film, align the exposed face with the heat sink, and lower the pad slowly to avoid trapping air bubbles.
  5. If bubbles appear, lift one edge of the pad and repeat the previous step, or use a soft roller or squeegee to work the air out toward the edge.
  6. Peel off the second film gently. Excessive force can tear the pad or lift it off the heat sink.
  7. Once the pad is in position, apply light, even pressure across the heat sink so the pad seats fully and stays fixed in place.
For further information or application support, please contact ATI.
Weight 0.8 lbs

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