The cooling principle of TEC is shown in figure 1. P and N type semiconductors are sandwiched between metal plates, which can form a pathway. Under the action of external electric field, the hole of P type in the point(a) needs to absorb certain energy to improve its own potential energy and then goes into P type semiconductor, so the temperature of the junction can be decreased and the cold contact point is formed. But the hole in the point(b) needs to release the excess energy to enter thesheet metal, and then the junction temperature will rise to form a hot contact.(more)
Thermoelectric cooler (TEC) is built due to the Peltier effect, which both have the abilities of heating and cooling. When comparing with the traditional cooling method, vapor compression cooling, TEC has the following features:(more)
When proper measures have been adopted to protect the TECs from being overheated, we can solder the TEC with metalized surface to thermoelectric components. In order to prevent the TEC from excessive mechanical force, solder one surface (usually hot end) to a component with rigid structure. It's worth noted that when we solder the TEC to a rigid structure component, other components or small circuits shall be soldered in the cold end of the TEC, which will not connect to the external structure rigidly. During soldering, in order to prevent the TEC from excessive heat, we need to control the temperature precisely. In the meantime, the temperature during the process will not exceed the operating temperature of TECs. Since the coefficients of thermal expansions of ceramic plates, heat sink and the object are different, it's not recommended to use soldering method in over 15×15 mm2 TECs.(more)
(c) Use proper pre tin in the soldering area of the surface of the heat sink. Thus, the melting point of the solder shall be lower or equal to the maximum operating temperature of the thermoelectric cooler. When plating tin on the heat sink, we shall keep the temperature of the heat sink in a proper temperature, which could melt the solder but not exceed the maximum operating temperature of the TEC .(more)
Thermoelectric cooler (TEC) is built on the Peltier effect. Due to the internal structure features of semiconductor material, it has more obvious thermoelectric effects than other metals do. Therefore, semiconductor material is usually used for making TEC.(more)
LED controller control LED lamp switch of each location in circuit by using the chip processing. According to the preset procedure, the controller controls the driving circuit to make the LED array regularly luminescence. Then it can display a text or graphics. LED controller has many advantages, which can prolong the lifetime of LED and save energy. The LED controller also has convenient wiring. What’s more, according to the actual needs of customers, it can realize the change effect of jump and gradual light.(more)
Thermal conductive silicone piece: it’s based on silica gel material; add some metal oxide as the auciliary materials. It’s medium about heat conduction material by a special technology.(more)
ATE1-127 TEC Modules have 127 pairs of Peltier elements. The maximum voltage is 15.4V, and there are 17 kinds of maximum current to choose from. The TEC module is used to accurately adjust the object temperature, when working with TEC controller, a highly stable and efficient temperature control system is constituted. ATE1-127 TEC is composed of two pieces of bare ceramic plate with very smooth surface. The ceramic plates can be installed to the flat surface of the metal, and there are a few layers of thermal conductivity of filler material (thermal conduction silicon or conductive grease) between them. When installing, please ensure uniform force so that thermal contact between TEC ceramic and metal will be good, and thermal resistance will be reduced to the minimum.(more)
